Ou, Shengquan: search on Z-Library

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1

[IEEE 2015 34th Chinese Control Conference (CCC) - Hangzhou, China (2015.7.28-2015.7.30)] 2015 34th Chinese Control Conference (CCC) - A self-tuning disturbance observer based adaptive speed control for PMSM servo system

Juan, Li, Shengquan, Li, Shihua, Li, Meiying, Ou

Year:

2015

File:

PDF, 526 KB

2015

2

Optical fiber packaging by lead (Pb)-free solder in V-grooves

Shengquan Ou, Gu Xu, Yuhuan Xu, K.N. Tu

Journal:

Ceramics International

Year:

2004

Language:

english

File:

PDF, 249 KB

english, 2004

3

A cascaded deep learning wind power prediction approach based on a two-layer of mode decomposition

Yin, Hao, Ou, Zuhong, Huang, Shengquan, Meng, Anbo

Journal:

Year:

2019

Language:

english

File:

PDF, 1.29 MB

english, 2019

4

Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints

Zhang, Lingyun, Ou, Shengquan, Huang, Joanne, Tu, K. N., Gee, Stephen, Nguyen, Luu

Journal:

Applied Physics Letters

Year:

2006

Language:

english

File:

PDF, 473 KB

english, 2006

5

[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Micro-impact test on lead-free BGA balls on Au/electrolytic Ni/Cu bond pad

Shengquan Ou,, Yuhuan Xu,, Tu, K.N., Alam, M.O., Chan, Y.C.

Year:

2005

Language:

english

File:

PDF, 3.27 MB

english, 2005

6

The application of lead-free solder to optical fiber packaging

Shengquan Ou, Gu Xu, Yuhuan Xu, K. N. Tu

Journal:

Journal of Electronic Materials

Year:

2004

Language:

english

File:

PDF, 792 KB

english, 2004

7

Measurement of impact toughness of eutectic SnPb and SnAgCu solder joints in ball grid array by mini-impact tester

Xu, Yuhuan, Ou, Shengquan, Tu, K.N., Zeng, Kejun, Dunne, Rajiv

Journal:

Journal of Materials Research

Year:

2008

Language:

english

File:

PDF, 828 KB

english, 2008

8

[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - A study of electromigration in Sn3.5Ag and Sn3.8Ag0.7Cu solder lines

Shengquan Ou,, Tu, K.N.

Year:

2005

Language:

english

File:

PDF, 1.80 MB

english, 2005

9

Nano-crystallization and magnetic properties in the highly resistive Fe–Si–Zr–O films prepared by EB-PVD

Xiaofang Bi, Shengquan Ou, Shengkai Gong, Huibin Xu

Journal:

Materials Science and Engineering: A

Year:

2003

Language:

english

File:

PDF, 514 KB

english, 2003

10

Magnetic and electrical properties of FeSi/FeSi–ZrO2 multilayers prepared by EB-PVD

Xiaofang Bi, Weihua Lan, Shengquan Ou, Shengkai Gong, Huibin Xu

Journal:

Journal of Magnetism and Magnetic Materials

Year:

2003

Language:

english

File:

PDF, 264 KB

english, 2003

11

Bubble evolution mechanism and defect repairing during the fabrication of high-quality germanium on insulator substrate

Ke, Shaoying, Zhou, Jinrong, He, Shengquan, Ou, Xuewen, Li, Cheng, Chen, Songyan

Journal:

Semiconductor Science and Technology

Year:

2020

Language:

english

File:

PDF, 1.20 MB

english, 2020

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